Barnes International to exhibit at BAI Payments Connect
Petersfield, UK, February 17th 2015 – Barnes International, a global smart card test tool leader and supplier to Banks, Issuers, Card Manufacturers, Personalization Bureaux and Test Laboratories, today announced they will be exhibiting at BAI Payments Connect, taking place March 2 – 4 2015 at the Phoenix Convention Center, USA. This conference attracts over 700 decision makers who gather for 3 days to learn about the latest trends and developments shaping the payments industry.
Visitors to the Barnes booth (#513) will be able to see demonstrations of Barnes solutions, which include magnetic stripe analyzers and EMV chip test tools. Their products are used worldwide by banks, issuers and personalization bureaus to ensure their chip debit and credit cards and mobile payment products meet the requirements of their chosen payment scheme, such as American Express, Discover, MasterCard or Visa.
In addition, card manufacturers and test laboratories use Barnes test tools in the development and manufacture of ISO, CQM and EMV compliant contact, contactless and dual interface cards and mobile payment applications.
Barnes also offers EMV migration training across the US. Delegates to their 3-day chip training course leave with the knowledge and confidence to successfully apply EMV technology to their cards and payment business. Upcoming dates include: March 30 – April in Dallas; April 28 – 30 April in Washington, and June 3 -5 in Miami.
Brian comments: “2015 is a significant year for the US payments industry, and we expect there will be major discussions at BAI Payments Connect about the move from magnetic stripe to EMV chip cards. As we have over 20 years’ experience of successfully supporting organizations with EMV, we invite delegates to visit our booth to learn how we can help. We also have a couple of EMV White Papers to share, which will be useful for people new to EMV”.
To arrange a meeting with Mr Summerhayes at BAI Payments Connect, please email email@example.com.